Ball AOI / Bump AOI
Ball AOI / Bump AOI Prodcut Presentation
Particle inspection equipment MRD-3100 series for COG, FOG, and COF products, particularly for the binding defect detection of LCD display module.
Leading in the industry, reaching the technical level of its counterpart made in South Korea;
Satisfying the LCD modules in different sizes, including smart wearable devices, cell phones, tablets, laptops, in-vehicle devices, displays, TVs, and other products;
Adopting the modular design, applicable to unilateral, multillateral COG, FOG, COF process product inspection.
Covering the detection items as follows: bump offset, particle count, bump foreign objects, FPC corrision, and Bump area crack fragments.
Ball AOI / Bump AOI Key Points
1. Detection accuracy: 3um, leading in the industry
2. Software functions: independently developed algorithms, software function customization services;
3. Auto-focus imaging system, satisfying the detection needs of products in different sizes;
The founding team of MegaRobo has over 10 years of industry background for industrial automation. At present, the team has more than 350 people. Driven by independent research and development and technology innovation, MegaRobo has accumulated a number of core technologies with world competitiveness and applied for over 150 invention patents. It co-built the laboratory with Beijing Jiaotong University and Xidian University, and its products have passed ISO9001 Quality Management System Certification. The clients include many well-known enterprises in the industry, such as BGI, Berrygenomics, Wuxi AppTec, RoboCup, Greenland Deepblue, Tesla, Ford, Sinopec, China Aerospace, etc
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